Monthly Archives: November 2011

Oerlikon Delivers Packaging System “HEXAGON”

Oerlikon Delivers Packaging System “HEXAGON” By Rogier Lodder, Senior System Engineer/ Oerlikon Systems The new HEXAGON production system represents the next generation in high-throughput PVD production.  The new system is specialized for 300 mm packaging applications – under bump sputtering … Continue reading

Posted in Product News
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